PCI/104-Express
Specification: PCI/104-Express
Version: 3.0
Latest Release: February 17, 2015
Status: Active
Dimensions: 3.775 x 3.550 in.
Stackable Buses: PCI Express and PCI
The PCI/104-Express™ specification establishes a standard to use a high speed PCI Express® bus in embedded applications. The Consortium chose PCI Express® because of its full PC market adoption, performance, scalability, and growing silicon availability worldwide. It provides a high-performance physical interface while retaining software compatibility with existing PCI infrastructure.
Incorporating the PCI Express® bus within the industry proven PC104 architecture brings many advantages for embedded applications including fast data transfer, low cost due to the unique self-stacking bus of PC104, high reliability due to the inherent ruggedness of PC104, and long-term sustainability.
The latest revision to this specification includes OneBank® which uses a smaller, one-bank version of the PCIe/104 connector, consisting of up to 4 PCIe x1 links.
PCIe/104
Specification: PCIe/104
Version: 3.0
Latest Release: February 17, 2015
Status: Active
Dimensions: 3.775 x 3.550 in.
Stackable Buses: PCI Express
PCIe/104 is PCI/104-Express without the PCI bus. Aside from this difference, PCIe/104 and PCI/104-Express are mechanically and electrically identical stackable architectures.
Like the PCI/104-Express spec, the latest revision of PCIe/104 includes OneBank® which uses a smaller, one-bank version of the PCIe/104 connector, consisting of up to 4 PCIe x1 links.
Future-104
Specification: TBD
Version: 1.0
Anticipated Release: 2026
Status: Proposed Work Group
Dimensions: 3.775 x 3.550 in.
Stackable Buses: PCI Express
This next-generation, stackable small form factor specification will deliver higher bandwidth and greater performance while maintaining the scalability and interoperability core to our specifications. The specification will enable a robust, future-ready standard to support a wide range of applications — from edge computing and autonomous systems, to industrial and defense platforms.
Contact info@rmsconsortium.org for information on how to participate in this specification development.
EBX Express™
Specification: EBX Express
Version: 3.0
Latest Release: June 23, 2008
Status: Active
Dimensions: 8.00 x 5.75 in.
Stackable Buses: PCI Express and PCI
EBX Express brings the PCI/104-Express footprint to the existing EBX form factor.
EPIC Express™
Specification: EPIC Express
Version: 3.0
Latest Release: June 23, 2008
Status: Active
Dimensions: 8.00 x 5.75 in.
Stackable Buses: PCI Express and PCI
EPIC Express brings the PCI/104-Express form factor to the existing EPIC form factor.